Development of computer chips cooling

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Striving for the minimum temperature under processor load
I think 50-70 degrees under load is a lot, and need to reach the opposite point close to processor cold freezing.
Can blow on the processor chip or leak сcold liquid on it, by removing the lid and radiator?

And add isobutane to the tubes of the processor cooler and pump it, or replace the liquid with gas in watercooling?
 
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Can we assume you are talking about computer processor chips? OP is a bit ambiguous on the relevant industry.
 
DaveC426913 said:
Can we assume you are talking about computer processor chips? OP is a bit ambiguous on the relevant industry.
Yes.
 
IMO it's wise to follow the manufacturer's advice when cooling high power chips. 'Artificially' keeping the heat sink temperature low will not always reduce the dissipation the semicolnuctor. There are internal thermal interfaces, on the way out to the heat sink and the temperature inside may be higher than you think. You just can't say what's going on inside the package. The manufacturers could afford to take chips to destruction when testing but maybe you can't.
 
I would prefer a liquid or gaseous thermal interface, then the cooling efficiency would depend on the temperature and flow rate.
I think the isobutane being rotated by the pump in the tubes will partially correct the radiator cooling.
 
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